Wafer Billet

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硅铝合金电子封装

Wafer Billet

Material: Al-Si Alloys

 

Baienwei AlSi alloys are available in the form of plates

and bolcks,or machined and plated component,ready

for manufacturing into different products. 

 

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Product Application

· High-brightness LED wafer substrate assembly;

· Photovoltaic (PV) array

 

Materials: Silicon Aluminum Alloys(AlSi70).


Configuration: Platforms,Plug-ins,Flatpacks etc.

 

Advantages of wafer products

· Match with sapphire and arsenic gallium CTE;

· Wafer diameter can be achieved by 300mm and polishing to 10nm Ra;

· High thermal conductivity;

· Provided wafer with gold bonding layer;

· Ease of manufacturable and platability.

 

 

AlSi Alloys Performance Parameters:

Content Density    g/cm³ CTE    ppm/℃ Thermal   Conductivity W/mK Tensile  Strength MPa Yield  Strength  MPa Poisson’s  Ratio Elongation % Elastic  Modulus   GPa 
Al-27%Si 2.6 17 175 170 130 0.29 3.8 91
Al-42%Si 2.55 13.5 143 200 187 0.29 1 105
Al-50%Si 2.5 11.5 140 200 210 0.28 <1 108
Al-60%Si 2.46 9 125 181 181 0.27 <1 121
Al-70%Si 2.43 7.5 120 138 138 0.25 <1 131
Content Density    g/cm³ CTE    ppm/℃ Thermal   Conductivity W/mK Tensile  Strength MPa Yield  Strength  MPa Poisson’s  Ratio Elongation % Elastic  Modulus   GPa 
Al6061 2.7 22.6 210 312 270 0.33 12.5 69
Al4047 2.66 21.6 193 208 129 0.33 18 70